Manufacturing & Logistics IT news magazine for manufacturing supply chain, warehousing, transportation and distribution

Manhattan Active® Transportation Management (TM) also ranks among the three highest ranked vendors in the Level 3 Complexity, Level 4 Complexity and Level 5 Complexity Use Cases in the accompanying Critical Capabilities report.

As supply chains grow in complexity, enterprises are looking to better orchestrate transportation and distribution processes with a unified supply chain execution solution.

Insight from the IMI’s Diversity Task Force, published in its latest report – Driving Towards Inclusion - reveals a more positive picture of diversity in many areas.

Microlise Group, provider of technology solutions, has announced its alignment with the latest Transport for London (TfL) Direct Vision Standards (DVS) requirements, set to take effect on Monday 28th October 2024.

SAP SE has announced AI advancements in its supply chain solutions that the company believes will unleash a transformative wave of productivity, efficiency and precision in manufacturing.

TeamViewer, the global provider of remote connectivity and workplace digitalisation solutions, has entered into a strategic partnership with Manhattan Associates, a leader in warehouse efficiency and supply chain solutions.

Responding to the DEFRA blog regarding the planned introduction of border checks on 30 April: Coverage about upcoming border checks,  Nichola Mallon, Head of Trade and Devolved Policy at business group Logistics UK, says:

Business activity among UK SMEs has expanded at a solid rate throughout the first quarter of the year with the NatWest SME PMI Business Activity Index recording 52.6 in March.

SEGRO and St George were joined by Councillor Shama Tatler, Cabinet Member for Regeneration, Planning and Growth at Brent Council and a range of local dignitaries to celebrate the completion of SEGRO V-Park Grand Union – the multi-storey industrial development in Alperton, North West London.

By Dr Yu-Han Chang, Senior Technology Analyst at IDTechEx.

Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth.

New data from Tradeshift's Q1 Index of Global Trade Health paints an encouraging picture for global trade, with robust growth observed in China and the US, alongside indications of a rebound in global demand for manufactured goods.

Some 95% of IT leaders across industries have voiced concerns over the implications of not modernising applications and data running on mainframe systems.